According to sources close to MacRumors, Apple is abandoning the development of the next-generation Vision Pro headset after the product failed to capture significant market share. With sales of "only" 600,000 units, Apple has not seen this product line take off as its other products have. Launched in February 2024, the Vision Pro headset debuted with a steep $3,499 price tag. In October 2025, about a year and a half later, Apple updated the Vision Pro with its latest 3 nm M5 SoC, typically used in MacBooks, but even this refresh failed to generate significant interest and orders from users. Although the system offers a technically impressive solution, the market has reacted poorly, particularly due to the high price point Apple set.

Technically, the headset features a micro-OLED 3D display system with 23 million pixels and weighs between 750-800 grams, depending on the headband choice. However, users have complained about the device's weight and distribution, especially around the nose area, which often feels heavy on a single pressure point. No headband choice has been able to completely alleviate this issue. Additionally, the price point is too high for consumers, especially for a technology that is relatively new to the Apple ecosystem. As a result, MacRumors tipsters suggest that Apple is close to completely abandoning the project.

Intel recently unveiled its "Wildcat Lake" Core 300 series of laptop processors, designed for the entry-level market with excellent CPU and GPU capabilities to meet basic needs. By combining two "Cougar Cove" P-cores with four LPE "Darkmont" cores, these processors should provide sufficient CPU power for basic tasks in the entry-level segment. Especially when paired with the NPU 5, Xe display and media engine, and a GPU featuring up to two Xe3 cores, this SoC should handle tasks with ease, including some very light entry-level gaming. Today, the first benchmarks appeared, showcasing what this CPU is capable of and how it compares to industry-leading solutions in this price range, such as Apple's newest MacBook Neo, thanks to the initial PassMark benchmark results.

In the latest benchmark, PassMark recorded the Intel Core 5 320 "Wildcat Lake" with two P-cores running at up to 4.6 GHz and LPE cores with a maximum turbo frequency of 3.4 GHz. This SoC scored about 4,047 points in the single-threaded rating and approximately 15,222 in the multithreaded rating in the PassMark evaluation benchmark. This places its rating just above Apple's first-generation M1 SoC in both single and multithreaded results. Additionally, the design surpasses Apple's A18 Pro SoC in the current MacBook Neo and the A19 Pro SoC that is expected to be included in the second-generation MacBook Neo design scheduled for 2027. Technically, both are based on different architectures, but they serve the same purpose: providing customers with an affordable SoC/laptop design that delivers solid computing power for all basic tasks.

One of the first Intel "Wildcat Lake" laptops has been revealed, showcasing a design language that closely resembles Apple's highly popular $599 MacBook Neo model. Intel's own reference design model features a standard 6-core "Wildcat Lake" configuration with two Xe3 cores and a 17 TOPS NPU, all housed in an aluminium chassis with a bright color theme, similar to Apple's MacBook Neo. The Intel reference design "Wildcat Lake" laptop operates with a 17 W PL1 mode, which measures the base TDP, and a 35 W PL2 for running the new WCL chip at maximum turbo frequency. There is also a high-performance mode for maximizing core performance with a 22 W PL1 base TDP, as well as a mode for fanless operation. In the PL1 power mode at 11 W, WCL chips can function in fanless environments, making them very versatile.

When Intel launched the "Wildcat Lake" Core 300 series of processors, the company aimed to satisfy value-oriented buyers seeking good CPU performance and basic GPU output in small form-factor commercial and edge AI PCs. The platform's hybrid core configuration, combining two "Cougar Cove" P-cores with four LPE "Darkmont" cores, should provide sufficient CPU power for basic tasks in the entry-level segment. Especially when paired with the NPU 5, Xe display and media engine, and a GPU that includes up to two Xe3 cores, this SoC should handle tasks with ease, along with some very light entry-level gaming.

Apple has officially announced that long-time hardware chief John Ternus will become the company's new Chief Executive Officer (CEO), taking over from the current CEO, Tim Cook. We have reported that Apple's succession planning is underway as the company considers who will lead one of the largest and most powerful companies in the world. As we reported late last year, John Ternus, Apple's Senior Vice President of Hardware Engineering, has been selected as the prime candidate for the new role. He has been with Apple since 2001 and has led the hardware division since 2013. Under his leadership, the hardware engineering efforts behind the iPhone, iPad, the entire Mac lineup, AirPods, Vision Pro, and countless prototypes have been developed. One of his most impressive feats is leading the transition of Apple MacBooks from Intel-based designs to custom, in-house developed Apple Silicon SoCs.

Interestingly, John Ternus will officially become CEO on September 1, 2026, when Tim Cook steps down to become Apple's executive chairman. Ternus and Cook will collaborate on the transition over the summer months to ensure that Apple's long-term goals remain a priority. "It has been the greatest privilege of my life to be the CEO of Apple and to have been trusted to lead such an extraordinary company. I love Apple with all of my being, and I am so grateful to have had the opportunity to work with a team of such ingenious, innovative, creative, and deeply caring people who have been unwavering in their dedication to enriching the lives of our customers and creating the best products and services in the world," said Tim Cook.

Intel's upcoming "Crescent Island" series of GPUs, based on the newly developed Xe3P graphics IP, will be hitting the market this year. However, it seems this IP won't be featured in the desktop Arc gaming series of discrete GPUs. According to a reliable leaker, Jaykihn, Intel will not release this GPU generation as dedicated Arc gaming graphics cards. Instead, Xe3P-based GPUs will power "Crescent Island" data center and workstation GPUs, similar to the current Arc Pro series for professional users. This leaves Arc gamers without a clear indication of when, or even if, they will receive a new gaming Arc GPU based on the Xe3 or Xe4 IP in the coming months.

Intel recently announced the Arc Pro B70 and Arc Pro B65 graphics cards, which maximize the BMG-G31 "Battlemage" Xe2 silicon but are intended for professional users only. A recent driver update added the ability to play games on these cards, but they are still primarily designed for AI workloads and professional visualization. Gamers are still seeking clarity about future updates, and the lack of recent rumors regarding an additional Arc gaming discrete GPU is concerning. Even the higher-end Arc B770, which has been rumored for some time, seems to be on hold. Upcoming events like Computex might offer Intel a chance to at least provide a teaser of what the desktop Arc GPU family will look like or if there will be any updates soon.

Elon Musk announced today on X that Tesla has completed the design of a new generation of its AI chips for Full Self-Driving (FSD). The CEO also mentioned earlier that the AI5 chip will offer performance comparable to NVIDIA's "Hopper" architecture, with two AI5 units matching the power of a single "Blackwell" processor. In late 2025, reports indicated that Samsung had achieved a significant win for its previously struggling foundry business, as Tesla decided to split the manufacturing of its new AI5 accelerator between Samsung and TSMC. The chips will be produced at Samsung's plant in Taylor, Texas, and TSMC's facility in Arizona. This decision is part of a strategy to keep the supply chain diversified and maintain chip supply under control for any demand scenario.

Samsung and TSMC are not the only partners in this project. Tesla is also sourcing DRAM chips from SK hynix, which appear to be LPDDR5X memory integrated into the package. On both the left and right sides, there are two rows of SK hynix LPDDR5X memory modules, each with three modules. This totals 12 LPDDR5X memory modules per AI5 chip. With 16 GB per module, this results in 192 GB of LPDDR5X memory per single AI5 SoC.

Yesterday, SemiAccurate posted a rumor that NVIDIA was planning to acquire a large PC maker, which would have reshaped its position within the PC space. However, it turns out the rumor is not true. NVIDIA issued a statement to CNBC saying, "The media report is false; NVIDIA is not engaged in discussions to acquire any PC maker." This brief statement effectively shuts down the rumors, suggesting that NVIDIA does not plan to go through with such an acquisition, even if it might have been considered in the past. Large corporations, especially with NVIDIA's $4.6 trillion market capitalization, are always looking to expand their business in areas where they are dominant and enter new markets where they could capture a significant share. NVIDIA holds a strong position in the dedicated GPU market, with about 94% market share among AIB GPU shipments.

The company is also looking to enter the laptop space with the upcoming N1/N1X SoCs, which would allow NVIDIA to tap into a completely new segment among PC users. In this context, acquiring a PC company would be a logical move, but it would present significant regulatory hurdles, as the company might not get approval from market regulators in the United States, European Union, and other regions. Now that we know the rumor is not true, we are waiting to see if any more rumors emerge about which company might have been the potential target. For now, we are refraining from making definitive claims or pointing fingers at any specific company.

We've already seen large swathes of the PC hardware market get drastically affected by the ongoing DRAM and general hardware crisis, from Valve's upcoming Steam Machine to pre-built desktop PCs. Now, it seems as though it's Microsoft's turn with its Surface device line-up, which has seen a price increase of anywhere between $200 and $500, depending on the exact model. The price increases mean that the 13-inch Surface Pro with the Qualcomm Snapdragon X SoC, 16 GB of RAM, and 512 GB of storage increases by $300 to $1,499; while the 12-inch Surface Pro with the Snapdragon X, 16 GB RAM, and 256 GB of storage increases from $799 to $1,049; the 13-inch Surface Laptop with the Snapdragon X Plus, 16 GB RAM, and a 256 GB SSD increases from $899 to $1,199; the 13.8-inch Surface Laptop with the same SoC and RAM but 512 GB of storage increases from $1,199 to $1,499; and the Surface Laptop 15-inch with the Snapdragon X Elite SoC, 16 GB of RAM, and 256 GB of SSD storage sees a price hike from $1,499 to $1,599.

Microsoft confirmed in a statement to Windows Central that the price increases were a direct result of the current hardware constraints, with a Microsoft representative stating "Due to recent increases in memory and component costs, Surface is updating pricing on Microsoft.com for its current‑generation hardware portfolio. We remain committed to delivering value to customers and partners while upholding our standards for quality and innovation." This news comes just after we reported that DDR4 spot prices have seen a marginal decrease. Microsoft's Surface line-up has never been the best value when it comes to Windows laptops, and they'll likely be an even tougher sell after the price hikes, especially with Apple's recent introduction of the hyper-popular $600 MacBook Neo and with the somewhat limited app and feature support that comes with Qualcomm's Snapdragon SoCs and Windows on Arm.

Apple has informed its supply chain that the company now aims to produce a total of 10 million first-generation MacBook Neo laptops, as consumer demand has been phenomenal. Initially, with the MacBook Neo launch, Apple expected consumers to purchase between 5 and 8 million units throughout the lifecycle of the first generation. However, since demand has exceeded initial expectations, Apple is significantly increasing production to meet this demand. As the Cupertino-based company has access to a wide network of manufacturing partners, ramping up production is straightforward, provided the main component—the A18 Pro SoC—is consistently supplied by TSMC.

Additionally, Apple is already planning a second-generation MacBook Neo with major upgrades to the overall system, primarily due to the new A19 Pro SoC, which will come with 12 GB of RAM. The current MacBook Neo features the mobile A18 Pro chip and is limited to 8 GB of RAM. According to recent rumors, Apple may upgrade the MacBook Neo's internals in 2027, equipping it with an A19 Pro, the same SoC found in the latest iPhone 17 Pro smartphones. Inside the MacBook Neo, Apple has opted to reuse the iPhone 16 Pro's chip, which is produced by TSMC and includes 8 GB of LPDDR5X memory. This memory is directly attached above the A18 Pro SoC using Integrated Fan-Out Package on Package (InFO-PoP) technology, creating a 3D wafer-level fan-out package.

Microsoft is now force-installing the latest version of Windows 11, the 25H2, for users of the older 24H2 version of the operating system. Through what Microsoft calls a "machine learning-based intelligent rollout," the company is automatically updating 24H2 users to Windows 11 25H2 when their devices are ready. This forced update is part of a staged update plan for Windows 11, where Microsoft is gradually updating systems worldwide to phase out the 24H2 version, as support for this operating system will officially end on October 13, 2026. It makes sense to upgrade users to an operating system with a longer support period. However, Windows 11 users might be frustrated with the constant forced upgrades that Microsoft is pushing, which seem to offer little real-world benefit beyond regular security maintenance.

Regarding Windows versions, the situation has been a bit confusing recently. Microsoft has dedicated the 26H1 update exclusively for Windows-on-Arm devices, supporting new silicon, including the Snapdragon X2 Elite and X2 Plus platforms, as well as the potential launch of NVIDIA's N1/N1X laptop SoCs. The latest feature and security updates have been delivered through both the 24H2 and 25H2 versions, which have been the primary focus for x86-based PC systems. However, as support for 24H2 is coming to an end, the focus is gradually shifting to 25H2. There is still time before October of this year, and Microsoft is using AI for a staged rollout. Importantly, users cannot refuse this update. They can only schedule the restart for the update to be applied or postpone it slightly before it is finally installed.

Valve's next-generation Steam Deck 2 handheld console is reportedly planned for release in 2028, with significant manufacturing changes expected for this sequel to the highly successful handheld gaming device. According to a well-known industry leaker, KeplerL2, posting in the NeoGAF community, Valve is targeting a 2028 refresh for the second-generation Steam Deck. However, the ongoing supply chain shortages of DRAM and NAND Flash could cause disruptions to these plans, potentially leading to delays. Interestingly, this period is when the shortages are expected to start easing, so the Steam Deck 2 could still be released on time, depending on Valve's sourcing capabilities.

One of the most significant procurement shifts for the Steam Deck 2 is Valve's choice of the computing base that will power the handheld. Instead of using a semi-custom AMD APU, Valve is expected to use an off-the-shelf AMD APU that won't require any custom tuning from AMD to meet Valve's needs. This is welcome news, as the latest Steam Machine showed that Valve's reliance on a semi-custom APU solution made the hardware "obsolete" quickly while the rest of the industry advanced. With any semi-custom solution, stockpiling silicon and waiting for DRAM/NAND modules to arrive puts pressure on Valve to ship a product that is significantly underpowered or too expensive. However, with an off-the-shelf solution, Valve could use the best available option at the time of shipping and optimize SteamOS around it.

Continued investment in AI infrastructure by major CSPs, including purchases of GPUs and deployment of in-house ASICs, has driven strong growth among AI-related chip designers, according to TrendForce's latest findings. In 2025, the total revenue of the top 10 fabless IC design houses exceeded US$359.4 billion, up 44% YoY. NVIDIA maintained its leading position, while Broadcom moved up to second place due to increased involvement in AI, overtaking Qualcomm, which continues to depend more heavily on consumer electronics.

Industry leader NVIDIA delivered another year of record revenue, supported by its strong AI chip portfolio and computing ecosystem. The company's fourth quarter revenue from data centers accounted for as much as 90% of its total. Full-year revenue rose 65% YoY to $205.7 billion—the fastest growth among the top players—with its share of total top-ten revenue increasing further to 57%.

Apple has officially discontinued its high-end Mac Pro desktop computer, with no plans to refresh the model in the future. According to the company, which confirmed the decision to 9to5Mac, Apple had been selling the Mac Pro alongside other Mac options that were more aligned with its strategic goals. Initially launched with a redesigned casing in 2019, the Mac Pro was powered by Intel processors until Apple decided to switch to its M2 Ultra SoC in 2023. However, this model has gone a long time without any hardware updates. Apple even introduced an M3 Ultra chip last year but decided to pair it with the Mac Studio instead. The Mac Studio is a smaller, more compact machine that offers greater performance than the Mac Pro while being more practical for various work environments. Multiple Mac Studios can also be interconnected with Thunderbolt 5, making them a potential compute cluster.

For now, Apple will maintain the Mac Studio as its "pro" Mac option, with a refresh expected either this year or next. The current top configuration of the Mac Studio includes an M3 Ultra chip with a 32-core CPU and an 80-core GPU. This powerful setup is paired with up to 256 GB of memory and up to 16 TB of SSD storage. With the introduction of this model without updating the Mac Pro, it was clear that the Mac Pro's days were numbered. Surprisingly, Apple's future desktop computer strategy will focus on the Mac Mini and Mac Studio, complementing its extensive lineup of MacBooks, which includes the Pro, Air, and the newly launched Neo. As one of the largest Apple computer lineups ever, simplifying and removing some products makes sense for a company that is focused on custom silicon.

Espressif Systems (688018.SH) proudly announces the upcoming release of ESP32-S31, a high-performance dual-core Wi-Fi 6 + Bluetooth 5.4 + IEEE 802.15.4 + Ethernet System-on-Chip (SoC). Building on Espressif's proven track record, this versatile SoC addresses the growing demand for advanced IoT applications including consumer and industrial appliances, smart speakers, voice-controlled devices, and automation systems requiring comprehensive wireless connectivity, edge AI capabilities, rich HMI, and robust security features.

ESP32-S31 delivers comprehensive wireless connectivity by combining Wi-Fi 6 (802.11ax) in 2.4 GHz band, Bluetooth 5.4 with both Bluetooth LE (Low Energy) and Classic (BR/EDR) support, plus an IEEE 802.15.4 radio enabling Thread and Zigbee protocols for diverse IoT applications. ESP32-S31 will provide a seamless support for Matter protocol over Wi-Fi as well as Thread radio.

Ayaneo, a well-known handheld gaming PC maker, has suspended its preorders for the Next 2 gaming handheld PC due to what the company describes as unsustainable pricing of its materials, making manufacturing and sales impossible. In an update on its Indiegogo page for the Next 2 device, Ayaneo states that the cost of storage has been higher than the company anticipated, surpassing an already inflated price quote. However, after the Chinese New Year, suppliers began providing quotes that exceeded every reasonable level, making Ayaneo's original lowest price of $1,999 for a device with an AMD Ryzen AI Max 385 processor, 32 GB of LPDDR5X memory, and 1 TB of SSD storage unfeasible. While the company offered more expensive variants with up to a Ryzen AI Max+ 395 SoC, 128 GB of RAM, and 2 TB of storage, even a price tag of $4,299 was insufficient to offset the losses from the costly components. The expensive RAM, very expensive NAND Flash, and AMD SoCs meant Ayaneo would be selling these handheld PCs at a massive loss.

This is where the advantage of larger OEMs comes into play, as they can secure slightly better contracts with memory and storage manufacturers, allowing them to get memory pricing into a somewhat decent range and even absorb losses until they can no longer sell their new PCs. Smaller makers like Ayaneo are not in such a position, and the company was forced to stop offering the Next 2 handheld for sale.

AMD is preparing to launch its "Medusa Point" APU in early 2027. However, more benchmarks are emerging to showcase what the actual SoC can do as AMD and its OEM partners test the chip. In the latest Geekbench v6 run, AMD's 10-core, 20-thread "Zen 6" chip appeared with the AMD Engineering Sample number 100-000001713-21_N, achieving a 2,300 single-core and 13,002 multicore score while officially running at only a 2.4 GHz base frequency. In real-world operation, it ran within the range of 2.0-2.1 GHz during the benchmark. The most surprising factor is that this "Medusa Point" test system can match a 10-core, 20-thread AMD Ryzen AI 9 365 "Strix Point" APU that operates at more than double the frequency. When comparing the two, "Medusa Point" scores slightly lower in single-core performance, while the multicore score is surprisingly higher.

This phenomenon could be attributed to the fact that the "Zen 6" cores in the "Medusa Point" APU are much better performing and more optimized for the workloads that Geekbench tests. The IPC improvement target from "Zen 5" in "Strix Point" to the newest "Zen 6" could be a high single-digit to low double-digit gain on average. It is likely that the combination of new instructions and IPC improvements is what is pushing "Medusa Point" so high. Since the new APU also appeared in firmware running AVX-VNNI in FP16 precision, we might be seeing these workloads getting accelerated thanks to the lower precision of the floating-point operations. For now, the situation remains a mystery, at least until more benchmarks are available in the coming months. AMD is expected to launch this new APU around CES 2027, so we still have a lot of time before official and third-party benchmarks are released.

With the latest Arc 101.8626 WHQL graphics driver, Intel has extended its precompiled shader delivery service to Intel Arc B-series GPUs and Intel Core Ultra Series 3 and Series 2 SoCs with built-in Intel Arc GPUs. This enhancement aims to significantly reduce game loading times. Intel's service gathers game shaders in the company's private cloud infrastructure, where they are processed and precompiled. When you install the Intel Graphics Software App, the service identifies the games you play and downloads the precompiled shaders for those games, using the Intel app as a distribution service and creating a folder with the precompiled shaders. This approach allows games to load much faster, reduces stuttering on the first launch, and automatically updates shaders whenever they are revised, with Intel's service pulling the new shaders into the shared folder on your PC. If this sounds familiar—Microsoft is working on a similar mechanism called "Advanced Shader Delivery," for release later this year. Intel's approach is separate and independent. For TechPowerUp, Intel confirmed the following:

IntelIntel Precompiled Shaders is custom built and run by Intel. We are also working with Microsoft's on launching Advanced Shader Delivery later this year. Together, both services will provide users of supported Arc GPUs with more game and game store coverage of technologies that reduce waiting times and in-game stutters due to shader compilation.

Imagine buying a laptop, thinking you're getting a model with your desired CPU specifications, only to find a completely different model inside, cleverly concealed so you wouldn't notice without further investigation. According to an investigation by Notebookcheck, the Chinese electronics maker Chuwi is engaging in specification fraud. Users have discovered a different CPU SKU compared to what was advertised. In a review of the Chuwi CoreBook X and CoreBook Plus, Notebookcheck found that Chuwi had listed these laptops with an AMD Ryzen 5 7430U processor, but they actually come with an AMD Ryzen 5 5500U. This means that Chuwi is actively advertising these models on their website, on the laptop box, with laptop stickers, and even with BIOS modifications to make it seem as if they feature the newer Ryzen 5 7430U SoC with "Zen 3" CPU microarchitecture and Radeon "Vega 6" SoC. In reality, the company is shipping a processor that is a few generations old, with "Zen 2" CPU cores and Radeon Graphics 448SP.

Notebookcheck discovered this during a review of the Chuwi CoreBook X. The unit's performance was rather lackluster, prompting further investigation. Initially, they thought single-channel RAM was causing the subpar performance. To determine the true cause, they opened the unit and found the older Ryzen 5 5500U SoC with its corresponding part number 100-000000375. Additionally, other differences were noted in the SoC specifications, such as the L3 cache. Chuwi even went a step further by using a modified BIOS version to show that the unit features the AMD Ryzen 5 7430U. This led software diagnostic tools to display the advertised specification, while the lower-tier SoC was actually inside. This issue didn't occur just once with the Chuwi CoreBook X but also with a separate CoreBook Plus, which Notebookcheck also confirmed to feature the older SoC. Instead of the newer AMD Ryzen 5 7430U processor, both of these laptop models actually come with the AMD Ryzen 5 5500U, as verified through performance testing, and the OPN number that corresponds to a specific AMD chip.

For the past half-decade, PC enthusiasts and audiophiles like me have been fighting a phantom war inside our systems. The enemy isn't audio fidelity, which has been democratized by Realtek by serving up codecs with SNRs well above 110 dBA; it is Deferred Procedure Call (DPC) latency. As the industry rapidly shifted toward complex, heterogeneous CPU architectures, and motherboard vendors simultaneously abandoned robust audio interfaces for cheaper USB routing, we inadvertently built a latency trap.

We are currently relying on brute-force host processing and software band-aids to fix a hardware routing problem. But there is a way out. It is entirely possible to build discrete sound cards with native signal processing to bypass these DPC gremlins once and for all.

SolidRun, a leading developer and manufacturer of high-performance system-on-module (SOM) solutions, single-board computers (SBC) and network edge solutions, announced its new P100 COM Express Type 6 module family, powered by AMD Ryzen AI Embedded P100 processors. Designed for real-world edge deployments where systems don't sit still, the P100 COMx6 series targets mobile platforms as well as harsh, mission-critical environments across industrial automation, transportation, medical systems, and robotics.

"Edge AI is moving out of controlled environments and into the real world, like mobile platforms, harsh industrial sites, and mission-critical deployments where serviceability, and longevity matter as much as raw compute," said Dr. Atai Ziv, CEO of SolidRun. "Our new P100 COM Express Type 6 modules are built to deliver powerful AI performance at the edge while improving the mechanical durability and serviceability product developers need to deploy confidently in demanding environments."

During MWC, Fujitsu partnered with networking equipment maker 1FINITY to unveil the first silicon wafers and an engineering sample of its "MONAKA" CPU. Scheduled for release in 2027, the initial Fujitsu MONAKA CPU utilizes the Armv9-A architecture and a 3D chiplet layout that combines a core die with separate SRAM and I/O dies. A single chip features 144 cores, and two-socket configurations can scale up to 288 cores per node. The platform supports 12-channel DDR5, PCIe 6.0 with CXL 3.0, and Arm SVE2 for AI and HPC workloads. Fujitsu has chosen TSMC to manufacture this chip using the 2 nm node, paired with Broadcom's 3.5D eXtreme Dimension System-in-Package (XDSiP) packaging architecture. This packaging allows MONAKA to become a 144-core design featuring four 36-core chiplets. These chiplets are stacked face-to-face with SRAM tiles through hybrid copper bonding, utilizing TSMC's N5 process for the cache layer.

In the pictures below, we can see the silicon complex in its early sample packaging, which shows a large central I/O die, HBM memory around the CPU, and the new packaging technology. Reportedly, this CPU has already reached a working version, with Broadcom shipping the CPU to Fujitsu in late February this year. After initial testing and early performance validation, Fujitsu plans to ship these processors to customers around summer, with mass shipping to commence in 2027. The company envisions this SoC as a powerhouse for AI inference, simulation, and large-scale data processing. It will sell these systems to external customers, who showed great interest in Fujitsu's A64FX when the Fugaku computer came online. Fugaku was the most powerful supercomputer back in 2020, achieving 415.53 PetaFLOPS of FP64 and an impressive HPL-AI score of 1.421 ExaFLOPS using lower FP16 precision. Hence, we expect the new MONAKA CPU to enable much greater speeds and some efficiency improvements as well.

Apple could name its upcoming laptop MacBook "Ultra" as the ultimate portable Mac from the Cupertino-based giant. According to Mark Gurman in the latest PowerOn newsletter, Apple is giving the MacBook a long-rumored "Ultra" overhaul, this time as an addition to the existing MacBook lineup, not as a product replacement. This model is expected to be Apple's first MacBook with an OLED touchscreen and a dynamic island instead of the traditional notch found on today's MacBook displays. It will sit above the new M5 Pro and M5 Max-powered MacBook Pro 14 and MacBook Pro 16, making Apple's new Mac lineup one of the most diverse in the company's history, especially with the recent launch of the MacBook Neo.

While March was reserved for the regular MacBook Pro devices, Apple is scheduling its MacBook Ultra overhaul for the end of this year, when we are also likely to see new chips powering the ultimate design. Pricing is expected to increase as well, as we have historically seen Apple introduce a price premium whenever a new OLED panel was installed on a device, similar to when the iPad received an OLED upgrade. These MacBook Ultra devices are codenamed K114 and K116 and are breaking with Apple's design philosophy, which has been critical of touchscreen devices for years. Apple's legendary co-founder Steve Jobs once called the touchscreen laptop experience "ergonomically terrible," but the competitive landscape has changed significantly over the past few years. To stay competitive, Apple is adapting to these industry changes slowly but surely. Interestingly, Gurman is not certain that Apple will definitely call it MacBook Ultra, it could also retain some Pro model naming, with clear differentiators for this model to sit at the top of the MacBook line.

We reported that Apple's M5 Pro/Max series of SoCs is now incorporating an additional core tier alongside the usual configuration we have been seeing in the company's processors for years. The performance core has been renamed "Super Core," and Apple has introduced a middle-tier design called Performance Core, which is actually a new "M-Core," while the Efficiency Core remains the same. As the regular big P-Core has been renamed to Super-Core, Apple is updating its nomenclature even for the regular M5 SoC with the macOS Tahoe 26.3.1 update. In this update, Apple has renamed the bigger Performance core to Super-Core, meaning that the M5 SoC now has four super cores and six efficiency cores, whereas this was previously called a four performance-core and six efficiency-core design before the update.

This M5 SoC has no new "M-Cores" variants that sit between the super core and efficiency core, while the M5 Pro and M5 Max have six Super-Cores and 12 M-Cores. The M-Core is a 7-wide out-of-order execution CPU that has roughly 70% of the P-core performance with slightly lower power usage. Interestingly, the efficiency core is completely absent from the new M5 Pro/Max SoCs, resulting in a combination of performance and middle-class cores. This leaves only the regular M5 with the efficiency cores in its CPU package. This macOS software update is only meant for the M5-powered MacBook Pro, which has been shipping with older macOS versions without the Tahoe's v26.3.1 update. For the latest MacBook Air and MacBook Pro equipped with M5, M5 Pro, and M5 Max SoCs, the operating system will likely already show the new naming out of the box, as Apple likely applied all OS updates before shipping. Below are screenshots courtesy of Andrew Cunningham from Ars Technica, showing the new nomenclature on the left, and old way on the right.

Yesterday, Apple announced its newest low-cost MacBook Neo, starting at $599 in the United States, or about $499 for education and students. Some online criticism emerged regarding Apple's decision to offer a laptop with only 8 GB of RAM in 2026, with no options for higher RAM capacity. However, this 8 GB of RAM is a design choice Apple made at TSMC's packaging facilities for the A18 Pro chip. Inside the MacBook Neo, Apple decided to reuse the iPhone 16 Pro's chip, which comes from TSMC with 8 GB of LPDDR5X memory. This memory is attached directly above the A18 Pro SoC using Integrated Fan-Out Package on Package (InFO-PoP), creating a 3D wafer-level fan-out package. This package is designed to hold memory directly above the SoC die, resulting in a smaller PCB design without the LPDDR5X module taking up over 100 mm² of PCB area.

Therefore, Apple's MacBook Neo configurations are limited to what the A18 Pro SoC is originally packaged with. These are 8 GB LPDDR5X modules that are shipped directly to TSMC for integration into the InFO-PoP package, which is later shipped back to Apple for integration into these new MacBook Neo laptops. While offering 8 GB laptops in modern times might seem controversial, the design choices behind the SoC and the goal of keeping unit costs low are what limit Apple from providing more memory capacity. Finally, these SoCs use Unix-based macOS, which is optimized for good memory management at this capacity, ensuring that users can still have a satisfactory experience.

Rambus Inc. (NASDAQ: RMBS), a premier chip and silicon IP provider making data faster and safer, today announced the industry's leading HBM4E Memory Controller IP, extending its market leadership in HBM IP. This new solution delivers breakthrough performance with advanced reliability features enabling designers to address the demanding memory bandwidth requirements of next-generation AI accelerators and graphics processing units (GPUs).

"Given the insatiable bandwidth demands of AI, it's imperative for the memory ecosystem to continue aggressively advancing memory performance," said Simon Blake-Wilson, SVP and general manager of Silicon IP, at Rambus. "As a leading silicon IP provider for AI applications, we are bringing the industry's leading HBM4E Controller IP solution to the market as a key enabler for breakthrough performance in next-generation AI processors and accelerators."