TSMC

Latest about TSMC

ASML looks to increase prices of its Low-NA EUV tools beyond existing productivity-based model — company wants to capture the value of all the advantages its tools offer, not just wafer throughput improvements

By Anton Shilov Published

ASML's comments point to intentions to increase prices, though the company is expected to maintain its value-based approach to price setting. Yet, TSMC is reportedly unhappy about the potential plan.

Semiconductors
TSMC commits another $100 billion to Arizona for at least four more 2nm fabs

By Luke James Published

TSMC will invest an additional $100 billion in the U.S. to build at least four more chipmaking plants and advanced packaging facilities in Arizona.

Tech Industry
Intel's EMIB packaging gains traction as chip designers look beyond TSMC's constrained CoWoS

By Anton Shilov Published

Premium Google has reportedly chosen Intel's EMIB-T over TSMC's CoWoS-L for its next-generation TPU, codenamed Humufish. But will Google be alone in its alleged decision?

Premium
Japanese chipmaker Rapidus to offer lower wafer pricing than TSMC — 2nm class silicon to be priced around $20,000 on 2027 launch

By Anton Shilov Published

Japanese chipmaker Rapidus discloses one more aspect of its strategy: to offer lower quotes than TSMC.

Semiconductors
TSMC is reportedly hiking prices for 'all advanced nodes,' accounting for 74% of the company’s wafer business

By Etiido Uko Published

TSMC has reportedly told customers to prepare for 5% to 10% price hikes across advanced chip nodes, extending beyond 3nm to include 7nm and some legacy processes.

Semiconductors
ASML Monopoly
Rare ASML Special Edition Monopoly board unearthed in social media trade

By Mark Tyson Published

We just witnessed a significant semiconductor industry related non-cash trade deal take place on Twitter/X.

Semiconductors
Post-silicon era gets closer as industry giants crack the 2D transistor scaling bottleneck with breakthrough tech

By Luke James Published

Imec, ASML, and TSMC have integrated both n-type and p-type transistors with atomically thin 2D channels on a single 300mm wafer.

Semiconductors
TSMC says panel packaging won't replace CoWoS anytime soon for the largest future AI processors

By Anton Shilov Published

CoPoS may enable larger chips, but CoWoS is still better.

Semiconductors
RAM Benchmark Hierarchy
RAM Benchmark Hierarchy 2026: DDR5, DDR4 for AMD, Intel CPUs

By Zhiye Liu last updated

Our RAM benchmark hierarchy ranks DDR5 and DDR4 memory kits of all frequencies and capacities for any budget.

RAM
Republican lawmakers urge federal agency to block imports of infringing TSMC chips as patent ruling nears

By Luke James Published

Four Republican members of Congress have urged the U.S. ITC to block imports of foreign-made chips found to infringe U.S. patents

Tech Industry
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