Latest about HBM
Premium We've compiled a full roadmap of HBM memory for SK hynix, Micron, and Samsung, including HBM3, HBM3E, HBM4, and HBM4E.
And that's without new tariffs on products from Japan and South Korea.
News Analysis Micron detailed its $200 billion U.S. investment plan to build six DRAM fabs and HBM assembly facilities in the U.S. over the next 20 years.
KAIST has a roadmap projecting the evolution of high-bandwidth memory from HBM4 to HBM8 through 2038, detailing major gains in bandwidth, capacity, I/O width, power, and even system architecture.
Micron has become the first DRAM vendor to begin sampling 36GB HBM4 memory with a 2048-bit interface and 2TB/s bandwidth.
SoftBank wants to corner the AI chip memory market with a more efficient substitute to HBM.
Future AI accelerators for China will not use the Hopper architecture, as Jensen Huang hints at a potential switch to Blackwell.
News Analysis Samsung plans to adopt hybrid bonding for HBM4 to improve thermal and interface performance, potentially gaining a competitive edge over SK hynix, which may delay its use due to costs concerns.
