AT&S

🔜 1 month to go: Europe’s semiconductor leaders meet at FIRST by FMD 2026 🚀 Hannes Voraberger, Vice President Corporate R&D at AT&S, will take the mainstage at FIRST by FMD 2026 in Berlin to share how advanced packaging and heterogeneous integration can create competitive advantages in the AI era. With a focus on strategic decisions for product development, time-to-market, and value creation. Don’t miss Hannes and other experts shaping the future of semiconductor technology. 📣 Topic: Advanced packaging in the AI era: Heterogeneous integration, 2.5D/3D and beyond 📅 Session: 1. October 2026 at 13:30 📍Main stage at EUREF-Campus, Berlin 🔗 https://lnkd.in/eZR5gr_A #ATS #FIRSTbyFMD #Semiconductor #Microelectronics #AdvancedPackaging #ICSubstrates #Chiplets #Innovation #FutureOfElectronics APECS Pilot Line

From a small Austrian town to the forefront of global innovation – Patrick Lenhardt’s journey at AT&S ✨ Patrick W. Lenhardt never planned a career in the electronics industry. What began as a job application close to home turned into a remarkable 20-year journey at AT&S. From engineering and R&D to leading global key accounts, Patrick has embraced every opportunity to learn, grow, and shape the future of advanced substrate technology. Today, as Vice President BU Key Account based in Kulim, Malaysia, he works with international teams, global customers, and cutting-edge technologies. His story proves that extraordinary careers can happen when preparation meets opportunity. What makes AT&S so special for Patrick? 🔷 The opportunity to grow through new challenges and global experiences 🔷 Working with talented international teams and world-leading customers 🔷 A culture that empowers people to learn, innovate, and succeed together 👉 Discover Patrick’s inspiring story: https://lnkd.in/e8KrGVEx #ATS #oneATS #teamATS #AdvancedTeamSpirit

Reliable simulation starts with reliable material data 📊 At AT&S, our Material Competence Center turns detailed material characterization into real engineering value. Operating around the clock, MCC has built a database currently with 1,043 characterized materials and more than 30 resin types under investigation. MCC enables more accurate simulations based on measured data supporting better decisions from thermal expansion and warpage to lifetime, failure mechanisms, and heat management. The result: fewer physical iterations, faster development cycles, and stronger engineering decisions. 💡 Recognized at the NAFEMS World Congress 2025, AT&S’s approach was highlighted as “unique and reliable” for simulation accuracy in automotive and powertrain engineering. Because behind every reliable simulation is one essential foundation: trustworthy material data. 👉 Learn more: https://lnkd.in/eq8wx-GC #ATS #oneATS #Engineering #Simulation #MaterialScience #VirtualDevelopment #Innovation #NumberOfTheMonth

The Agence France-Presse recently visited our headquarters and technology center in Leoben to see firsthand how AT&S is helping shape the future of AI infrastructure. The resulting story was picked up by numerous international media outlets, highlighting both the growing importance of advanced IC substrates and Europe's role in the global AI ecosystem. 📰 Read the full story here: https://lnkd.in/eeZXRetb As Michael Mertin explains "There are some outstanding technologies where we are world leaders in Europe." The story highlights how Leoben has become an important location in the global AI value chain. As AT&S continues to invest in innovation, research, and advanced packaging technologies, the company contributes to highly qualified jobs, international visibility, and sustainable economic growth in the region. #ATS #oneATS #AIRevolution #AFP #Innovation #AdvancedPackaging #MadeInEurope

Optical transceivers are powering the AI data highway⚡️ As AI workloads grow and data centers scale, high-speed optical transceivers are becoming critical for moving data faster, more efficiently, and with lower signal loss. AT&S supports this evolution with advanced and complex PCB and substrate solutions designed for 800G, 1.6T, and future high-speed optical transceiver architectures combining ultra-fine routing, high integration density, thermal reliability, and simulation-driven design. Discover how AT&S is helping enable the next generation of AI and hyperscale networks. 👉 Explore our new optical transceiver webpage: https://lnkd.in/efnKag9y #ATS #OpticalTransceivers #AIInfrastructure #DataCenters #Hyperscale #PCB #AdvancedPackaging #HighSpeedConnectivity

Key takeaways from the International Conference on Electronic Packaging Technology 2026 💥 AT&S was proud to participate in ICEPT 2026 in Xi’an, China a key platform for advancing dialogue across the electronic packaging ecosystem. With a record 2,000+ attendees, the event offered valuable opportunities to strengthen our presence in China, exchange insights with industry leaders, and showcase our expertise in advanced packaging and IC substrate technologies. Our experts Bula Wang and Anna Wei contributed to the technical program with presentations on "Advanced Organic Substrates Enabling Co-package Optics at Scale", and "Process Challenges, Reliability, and Failure Analysis for Advanced Packaging Substrates and High-density Interconnects" respectively. Discussions at the AT&S booth further highlighted the importance of materials innovation, manufacturing excellence, and reliable substrate solutions for next-generation high-speed data infrastructure. Thank you to the organizing committee for the photos and to everyone who connected with us at ICEPT 2026. We look forward to continuing the conversation and shaping the future of advanced electronic packaging together. 🤝 📷️ © ICEPT 2026 #ATS #AdvancedPackaging #ICsubstrates #CoPackageOptics #ElectronicsPackaging

A career built on trust, teamwork, and growth – Brigitte Achatz’s journey at AT&S 🌟 Brigitte Achatz’s career is proof that great opportunities often develop step by step. After gaining experience in sales, recruiting, and branch management, she joined AT&S in 2020 as part of the HR team in Fehring. Today, she supports everything from recruiting and onboarding to learning & development, helping shape the employee experience across the site. For Brigitte, success has never been a solo journey. Balancing career and family has only been possible through mutual support, trust, and collaboration – values that continue to guide her every day at AT&S. What makes AT&S so special for Brigitte? 🔷 The opportunity to make a real impact and help shape the workplace 🔷 A collaborative culture built on trust, respect, and openness 🔷 Continuous learning and development for both employees and leaders 👉 Discover Brigitte’s inspiring story: https://lnkd.in/erRypumn #ATS #oneATS #teamATS #AdvancedTeamSpirit

Innovation moves fast. Stay informed. The AT&S Newsletter delivers what matters. From experts to experts: innovation updates, new technologies, exclusive whitepapers and invitations to upcoming events directly to your inbox. From AI and Aerospace to Automotive, Medical, Semiconductors, and 5G, discover how AT&S enables the technologies driving our connected world. 📩 Subscribe now: https://lnkd.in/eHuaqfH6 #ATS #PCB #ICSubstrates #AdvancedPackaging #Newsletter #Electronics #Innovation

When does an application truly need an IC substrate, and when is HDI or SLP the smarter choice? In advanced packaging, the smartest choice is not always the most complex one. From PCB and HDI to SLP and IC substrates, the right technology depends on performance, manufacturability, cost, and application value. In this Expert Edition, Venkata R.S.S Mokkapati explores the spectrum from standard PCBs and HDI to SLP and IC substrates and explains why understanding the right technology fit is becoming more important as applications evolve across AI (inference), data centers, photonics, networking, automotive, 5G/6G, optical transceivers, mobile, memory, aerospace, and defense. #ICsubstrates #AdvancedPackaging #PCB #HDI #SLP #Microelectronics #ATS

AT&S achieves the strongest positive international media resonance among ATX companies We are proud to see that AT&S ranks among the most visible companies in the ATX and achieves the most positive international media coverage. The study by pressrelations Österreich analyzed how Austria’s leading businesses are perceived internationally and which stories resonate most strongly across global media. 🌍 The strong visibility was driven primarily by the global artificial intelligence boom, rising demand for IC substrates and high-end printed circuit boards, and AT&S's continued international expansion. The study also identifies the expansion of the company's Kulim site in Malaysia and the inclusion of AT&S in the STOXX Europe 600 index as key factors behind its strong international media presence. “The growing importance of AI demonstrates just how critical advanced microelectronics have become to the digital world. We are pleased that the achievements of our employees, our technologies, and our investments are attracting significant international attention,” says Michael Mertin, CEO of AT&S. Michael Mertin himself was also among the major winners of the reporting period. According to the analysis, he advanced ten places in the ranking of the most visible executives among ATX-listed companies, reaching third place overall. Thank you to everyone who is part of our journey. Together, we continue to shape the technologies of tomorrow. 👉 More details here: https://lnkd.in/e9TbQWXp #ATS #oneATS #ATX #GlobalMediaResonance #Austria